mrcy.com
The New SiP
Device Drives a
Leap in RF Edge
Processing
TOM SMELKER
VP and GM, Microelectronics,
Mercury Systems
TONY TRINH
Senior Director of Project
Management, Microelectronics,
Mercury Systems
WHITE PAPER
By integrating commercially developed processing and high
speed digitization at chip scale, new microelectronic devices
are poised to accelerate the latest defense applications