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2 custom.microelectronics@mrcy.com • Advanced miniaturization and ruggedization technologies • World-class high-reliability manufacturing • Specialized and comprehensive test solutions Why Choose Mercury Systems? For more than 30 years, Mercury Systems has delivered SWaP- optimized multi-chip modules (MCM) and System-in-Package (SiP) devices. Our advanced thermal and electrical modeling capabilities enable modern FPGA and processor adoption for today and tomorrow's most advanced military applications. Our domain expertise in rugged 3D packaging eliminates SWaP versus performance compromises. • Combine surface mount, flip chip, die attach and wire bond technologies on the same device • SWaP + Ruggedization – ideal for missiles, munitions and hypersonics • Material selection for high reliability - Gold bond wire and Lead (Pb) solder with wide ball pitch • Certified to MIL-PRF-38534 Class H and Class K and MIL- PRF-38535 Class M • Rapid development cycle from concept to prototype to volume production • Advanced 3D packaging using TSV interconnects in development Custom Design and Engineering Our focus on reliability and manufacturability reduces program risk for our customers' complex and sensitive military programs. SWaP Packaging Mercury Systems' expertise in advanced miniaturization and ruggedization technologies enable a custom microelectronic solutions in a SWaP-optimized footprint. Our skilled team of engineers develop multichip modules (MCM) and system in package (SiP) based on our customer's exact requirements. We utilize state-of-the-art electrical and mechanical design and simulation tools to optimize each device in the smallest, most rugged form factor. Thermal Management Our proprietary thermal design techniques channel heat dissipation from 160 to 800 W of power generated by today's most advanced processors and FPGA devices. We accomplish this through the use of multi-layer interlocked spreaders, customized thermal zones and the selection of ideal thermal composite materials to avoid overall CTE mismatch. Ruggedization to Gun Hardening Military systems operating in harsh environments require the use of military-grade, ruggedized microelectronics. Recognizing that no two missions are identical, we design all of our solutions to meet mission-specific environmental performance requirements. From -55°C to +125°C, you can count on our SWaP-optimized devices to operate reliably every time. Optional ruggedization capability to gun-hardening levels is available. Simulation Advanced 2.5D and 3D design techniques require accurate simulation and modeling to achieve power and signal integrity while taking into account thermal effects. Simulation and modeling of our complex designs enables rapid product development cycles and mitigates program risk. Mercury invests in world class tools for all areas of its business and utilizes the ANSYS suite of simulation and modeling tools to provide thorough performance data to drive successful custom designs. Advanced Design, Manufacturing and Test

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