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custom.microelectronics@mrcy.com
Advanced Manufacturing
With a 30 year pedigree in microelectronics
manufacturing, our Phoenix Advanced
Microelectronic Center (AMC) has delivered
microelectronics for the most advanced military
programs.
With an exclusive focus on high-reliability microelectronics for military
applications, our DMEA-trusted facility contains state-of-the-art
equipment to realize the most complex custom solutions. By mixing die
attach, flip chip, wire bond and surface mount technology on the same
device, we deliver the most performance in the smallest footprint.
Our design engineers work hand-in-hand with our factory floor for a
seamless transition to prototype and full rate production.
• Epoxy and die attach
• Surface mount to 01005
• Wire bond
• Flip chip
• Encapsulation
• PCB SMT
• Conformal coating
High-Reliability Test Solutions
Our turnkey test solutions assure that only the
highest quality product is delivered. We have
domain expertise in testing a broad range of
devices: FPGA, DSP, ASIC, SiP, GPS, GPS M-code,
and flash-based devices.
From functional to environmental to accelerated life testing, our team
of test engineers create scalable test solutions addressing
• MIL-PRF-38534 Class H and Class K for hybrid microcircuits
• MIL-PRF-38535 Class M for integrated circuits
• MIL-STD-883 for microelectronics devices
We specialize in developing custom test protocols to address
application- and mission-specific reliability requirements.
