White Paper

1 Figure 1. SpectrumSeries™ Compact Multi-Band Platform with integrated patch antenna The SpectrumSeries™ Compact Multi-Band Platform—a Complete Sensor Chain Solution To address these new challenges, we are developing a novel architecture that combines our expertise with compact hardware, dense integration, modular design and high reliability. The SpectrumSeries Compact Multi- Band Platform incorporates multiple board layers using a solderless, high-reliability approach. With a diameter ranging from 25 to 50 mm, six layers can be combined with a total height of also about 25 mm—small enough to support 50mm and below ammunition. Using pin-and-socket interconnects, the technology-agnostic solution is compatible with surface mount technology (SMT) boards, alumina chip- and-wire substrates, hermetic ceramic cavities and printed antennas. This flexible architecture provides the framework for a variety of applications such as simple single input/output radio communications or a complex monopulse radar with integrated patch antenna. In addition to miniaturized guided munitions, this platform has the capability to support multiple other applications that require a flexible and compact full sensor chain capability. This end-to-end solution seamlessly integrates the microwave transmit/receive circuitry with the digitization, processing and storage blocks. In addition to providing the electronics for ultra-compact guided munitions, this platform can also support a range of C4ISR applications. Whether receiving and processing information from a datalink, implementing a compact radar or intercepting and processing enemy signals, this flexible platform has the broad capability to provide the needed performance in a SWaP- optimized package. Figure 2. SpectrumSeries Compact Multi-Band Platform is an end-to- end sensor chain solution Introduction We all know of large, precision-guided weapons. Weighing in at about 3,000 pounds and with a unit price over $1M, the latest- generation cruise missiles can be launched from the safety of a ship and travel over 1,000 miles with the necessary precision to minimize collateral damage. These missiles include advanced electronics such as datalinks, radar altimeters, inertial guidance, and digital processing. While they represent the culmination of decades long technology development, an emerging need for smaller precision- guided munitions is forcing the defense electronics industry to find novel ways of building extremely compact, but also modular, systems. Developing a precision-guided capability small enough to fit into a munition that weighs less than 0.1% of a cruise missile, all for a fraction of the cost, requires a new approach built from the ground up. Existing Technology Fails to Achieve the Reliability, Modularity and Size Requirements While the current generation of large, precision guided weapons gives the U.S. and allied forces a significant advantage—the long range keeps the operators away from harm and the high precision reduces the risk of collateral damage—the options for surgical precision at the infantry level are far fewer. Specifically, there is an increasing need for sub-50mm munitions that contain the technology for precision guidance. Commonly referred to as "smart bullets," these precision-guided munitions require a new breed of RF and digital electronics that is not only compact, but modular enough to support a wide range of applications. The existing technology for electronics embedded into sub-50mm ammunition is limited in performance and modularity. In order to support next-generation applications, these electronics must be cutting-edge and incorporate a modular architecture that enables rapid upgrades. This modular design approach not only minimizes time-to-market, but also reduces costs by amortizing the development over multiple applications. In addition to a modular design, this new platform must include extremely dense integration and high reliability. Existing technologies tend to either take the shape of racks of sensor and processing hardware or a compact, custom form factor. To provide a cost-effective and multi-use capability, the new technology must be must be small enough to fit into the palm of your hand yet be as easy to upgrade as removing and replacing a circuit card.

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