White Paper

w w w. t m s . m r c y. c o m WHITE PAPER A BuiltSECURE System-in-Package A SiP solution embeds multiple integrated circuits (ICs) and passive components in a single, high-density BGA package. Compared to the development of a custom application specific integrated circuit (ASIC), this approach not only reduces the development cost, but also allows for a more flexible solution that can be redesigned to address emerging applications. Various components, such as a processor, memory, passives and power circuitry, may be stacked vertically or arranged side- by-side. In addition to the lower cost development cycle, this technology results in a compact package that is suitable for the SpectrumSeries Multiband Platform. Our advanced microelectronics capabilities utilize flip-chip, wire-bond, die stacking and 3D integration to achieve a compact and high-reliability solution. The ability to combine and stack different types of die enables maximum space savings. Unlike commercial SiP manufacturers, we are experienced in the quality levels required for military and aerospace applications. Reliability is ensured through careful thermal management and the use of materials with matched coefficients of thermal expansion (CTE). For the example block diagram in figure 5, the FPGA, memory, power circuitry and custom ASIC are assembled into a single 35x35mm BGA package. First, the FPGA is attached to the package substrate using a flip- chip process. The multiple memory ICs are then installed on top of the FPGA. The custom ASIC and power circuitry are assembled adjacent to the FPGA and memory. Once the assembly is complete, the components are ruggedized using a variety of encapsulation techniques. Since these products often store mission-critical information, we have developed BuiltSECURE technology to counter nation-state reverse engineering by providing the framework for custom system security engineering (SSE). This technology not only provides the required tamper-resistant features, but is also scalable and upgradable. As new threats emerge, this future-proof approach becomes increasingly critical. To provide increased security, our digital microelectronics products are manufactured in our domestic, DMEA certified facility. Mission-Critical Reliability With modular technology comes the challenge of ensuring the high reliability needed for aerospace applications. Reliability must be addressed from the earliest design phases all the way through production and must include a focus on both components and the entire assembly. While the details are tailored to the specific application, there are a few general techniques worth pointing out. In order to reduce cost and lead time, many applications allow the use of commercial or automotive-grade plastic encapsulated microelectronics (PEMs). In addition to verifying the material traceability and mitigating any pure tin, these parts receive a protective conformal coating after they are installed on the SMT board. Encapsulation of the sensitive RF components with a low-dielectric material increases reliability and enables operation in extremely high G environments. As more devices are integrated into a smaller form factor, dissipating the heat becomes a major challenge. Depending on the specific application, a carefully designed metal housing is used to conduct the heat away from the devices and to the case. The amount of thermal conduction required depends on both the program requirements, such as operational life time, and the total power dissipation in the devices. Extensive environmental testing measures the strength of the bond wires, resistance to temperature shock, quality of hermetic seals, performance over temperature and other parameters. Performing the majority of the testing on-site reduces lead time, cost and time-to-market. A Scalable, Modular, Multi-Use Framework This compact modular framework has the flexibility to support a range of applications. In basic configurations, this platform provides the electronics to support a simple narrowband datalink. However, by adding additional layers it can be scaled up to a multi-function capability that encompasses both broadband RF and digital devices. This integration of RF, digital processing and memory yields a complete sensor-chain solution. RF layers acquire and disseminate the signal, mixed-signal layers digitize the signal and the digital layers perform the signal processing. Through the integration of these various technologies in a single product, the maximum space savings is achieved. Additionally, the modular nature of this product allows for easy modification. For example, if the application only requires lower frequency operation, the layers containing the RF front end can be removed and the product can operate in a direct digitization mode. This scalable and modular approach not only can support a new breed of precision-guided munitions, but can be expanded to provide a cutting- edge technology to other applications requiring compact and reliable hardware. For example, Group I unmanned aerial vehicles (UAVs), having a maximum weight of 20 pounds, require extremely compact payloads. Additionally, digital beamforming technology requires miniaturized, mixed-signal hardware. Using this architecture, a compact system that supports multiple functions can be quickly realized for the specific application. This approach of integrating modular layers of RF, processing, memory and control circuitry in a compact and ruggedized outline applies broadly across countless applications. The modular nature of the SpectrumSeries Compact Multi-Band Platform enables solutions to be developed at a very rapid pace. As new threats emerge it is critical to quickly take advantage of the latest technologies to develop novel solutions. Through compact modularity, this architecture is optimized to rapidly provide the latest technology where it is needed most. 4 SECURE Built TM

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