White Paper

Understanding Broadband Electrical Behavior of Through-Silicon Via (TSV)

Issue link: https://read.uberflip.com/i/1233873

Contents of this Issue

Navigation

Page 4 of 7

The End of SWM and the Start of QTEM Mode When SWM ends at f e , the next mode begins: Quasi-TEM mode (QTEM). In order to accurately quantify the transition of SWM to QTEM mode, we need to utilize a 3D field-solver. For this simulation example, Ansys HFSS was utilized. The main difference between the HFSS model and the Keysight ADS model is the inclusion of a redistribution layer (RDL) both above and below the TSV S/G pair and a more complex stack-up of various materials. SiO 2 E-Field "Capture and Release": Transitioning from SWM to QTEM with Ansys HFSS Ansys HFSS allows viewing the magnitude of the E-field that is "captured" in the thin SiO 2 layer during the SWM of the TSV. Looking at Figure 5, at 1 GHz there is a significant amount of E-field "captured" in the SiO 2 layer. However, as the silicon relaxation frequency (f e )/~ 6 GHz is approached, the silicon transitions from a conductor to an effectively pure dielectric, which allows the E-fields to penetrate into the silicon. 4 Figure 5. E-field magnitude at 1 GHz Figure 6. E-field magnitude at 5 GHz

Articles in this issue

view archives of White Paper - Understanding Broadband Electrical Behavior of Through-Silicon Via (TSV)