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Understanding Broadband Electrical Behavior of Through-Silicon Via (TSV)

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w w w. m r c y. c o m INNOVATION THAT MATTERS ® For more information, visit mrcy.com or call (866) 627-6951. 8030.02E-0520-wp-TSV.indd CONCLUSION It's imperative to fully understand the broadband electrical performance of a given TSV structure. More specifically, SWM, which needs to be fully understood in order to successfully mitigate potentially catastrophic group delay in applications where group-delay "flatness" is critical. Utilizing a high bulk-resistivity silicon is one of the easiest methods to mitigate the unwanted effects of SWM. About the Author Seann Ayers is the Senior Principal Signal Integrity Engineer for the Microelectronics Secure Solutions group in Phoenix, Arizona. Seann has a BSEE from Wentworth Institute of Technology and has completed graduate courses in electrical engineering at Southern Methodist University.

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