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www.mrcy.com INNOVATION THAT MATTERS ® Corporate Headquarters 50 Minuteman Road • Andover, MA 01810 USA (978) 967-1401 • (866) 627-6951 • Fax (978) 256-3599 Copyright © 2020 Mercury Systems, Inc. www.mrcy.com 5601.00E 0620 Redefining Sensor Edge Processing with 2.5D System-in-Package Technology About the Author Thomas Smelker is Vice President and General Manager of Mercury's Custom Microelectronics Solutions group, where he is responsible for the management of multi-disciplined teams developing advanced solutions in semiconductor technologies at the system and subsystem levels for applications in embedded defense computing and systems security technologies. Prior to joining Mercury, Mr. Smelker spent nearly 20 years as a Senior Engineering Fellow and Systems Design Program Manager at Raytheon Missile Systems. At Raytheon, Mr. Smelker served as a leading expert developing strategic cyber and security technologies, including advanced secure system on chip (SoC) processors, security co-processors, multi-chip modules, and security firmware and software. During his time at Raytheon, Mr. Smelker was also a leading liaison with OSD, Air Force, Army, Navy, and DA customers, as well as with universities, government laboratories, and other partners. Mr. Smelker began his career as an Undergraduate and Graduate Fellow at the U.S. Army Research Laboratory. Mr. Smelker earned a master's degree in mechanical engineering (non-linear controls) from New Mexico State University and a bachelor's degree in mechanical engineering with a minor in mathematics, also from New Mexico State University. About Mercury Systems, Inc. Mercury Systems is the leader in making trusted, secure mission-critical technologies profoundly more accessible to the aerospace and defense industries. Optimized for customer and mission success, our innovative solutions power more than 300 critical aerospace and defense programs. Headquartered in Andover, MA, and with manufacturing and design facilities around the world, Mercury specializes in engineering, adapting and manufacturing new solutions purpose-built to meet the industry's current and emerging high-tech needs. Our employees are committed to Innovation That Matters®. Table of Acronyms ADC Analog-to-Digital Converter AESA Active Electronically Scanned Array AI Artificial Intelligence ASIC Application-Specific Integrated Circuits CPU Central Processing Unit DAC Digital-to-Analog Converter EW Electronic Warfare FPGA Field Programmable Gate Array GPU Graphics Processing Unit I/O Input/Output IP Intellectual Property RF Radio Frequency SiP System-in-Package SMT Surface Mount Technology SWaP Size, Weight, and Power UAV Unmanned Aerial Vehicle

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