MICROELECTRONICS FOR THE SENSOR EDGE
System-in-package and multi-chip modules
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Delivering the latest technology to these challenging
environments is a major undertaking. The hardware must
utilize the same semiconductor technology that powers
commercial data centers but in a compact and rugged
form factor. Additionally, a trusted supply chain and proven
processes are essential for mission-critical applications.
At Mercury, we make cutting-edge commercial technologies
profoundly more accessible to all customers and
seamlessly customize them for today 's most advanced
A&D applications. Leveraging high-density 2.5D system-
in-package technology, custom-designed silicon
interposers and 3D die-stacking integration, we partner
with leading semiconductor manufacturers to deliver
advanced technology to the harshest environments.
Mercury's microelectronic capabilities
for the sensor edge include:
▪ 2.5D system-in-package solutions
▪ 3D die stacking
▪ Secure multi-chip modules
▪ Direct digitization with integrated processing
▪ Microwave components and subsystems
▪ Board-level integration, including SOSA and OpenVPX
We provide standard products and custom solutions built
in AS9100- and DMEA-certified facilities. We're trusted
by leading defense primes and our microelectronics have
been proven on countless mission-critical programs.
Starting at chip scale with a trusted portfolio of microelectronic packaging capabilities
is essential for advanced edge computing. Whether processing high volumes of radar data
in the nose of a fighter jet, powering the latest UAVs or safely operating self-driving cars,
an increasing number of applications rely on processing technology at the sensor edge,
far from the data center.
Trusted Supply Chain Starting at Chip Scale
We start at chip scale with our high-density system-in-package technology,
designed and manufactured in trusted and secure DMEA-accredited facilities.
