Product Guide

Microelectronics Quick Reference Guide: Memory

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QUICK REFERENCE GUIDE mrcy.com Microelectronics Memories with Extended Temperatures Bullets condensed to be in highlight box Redesigned tables MEMORIES WITH EXTENDED TEMPERATURES DDR4 SDRAM MCP Size Organization Part Number Data Rate (Mb/s) Voltage (V) Package Dimensions Temperature 4 GB 51 x 72 4N512M72T-XB2X 1600–-2400 1.2 321 PBGA 13 mm x 20 mm C, I, M 8 GB 1G x 72 4N1G72T-XB2X 1600–2400 1.2 321 PBGA 13 mm x 20 mm C, I, M 16 GB 2G x 72 4N2G72T-XB2X* 1600–2666 1.2 367 PBGA 16 mm x 32 mm C, I, M DDR3 SDRAM MCP Size Organization Part Number Data Rate (Mb/s) Voltage (V) Package Dimensions Temperature 1 GB 128M x 64 W3J128M64X-XLBX 800–1600 K=1.35, G=1.5 375 PBGA 20.5 mm x 21.5 mm C, I, M 1 GB 128M x 72 W3J128M72X-XLBX 800–1600 K=1.35, G=1.5 375 PBGA 20.5 mm x 21.5 mm C, I, M 2 GB 512M x 32 W3J512M32X(T) -XB3X 800–1333 K=1.35, G=1.5 204 PBGA 10 mm x 14.5 mm C, I, M 2 GB 512M x 32 W3J512M32X-XB3X 800–1600 K=1.35, G=1.5 136 PBGA 10 mm x 14.5 mm C, I, M 4 GB 512M x 64 W3J512M64X-XLB2X 800–1600 K=1.35, G=1.5 543 PBGA 23 mm x 32 mm C, I, M 4 GB 512M x 72 W3J512M72X-XLB2X 800–1600 K=1.35, G=1.5 543 PBGA 23 mm x 32 mm C, I, M 4 GB HD 512M x 72 W3J512M72X(T) -XHDX 800–1600 K=1.35, G=1.5 399 PBGA 14 mm x 21.5 mm C, I, M 8 GB 1G x 72 W3J1G72KT-XLBX 800–1600 K=1.35, G=1.5 543 PBGA 23 mm x 32 mm C, I, M DDR2 SDRAM MCP Size Organization Part Number Data Rate (Mb/s) Voltage (V) Package Dimensions Temperature 128 MB 64M x 16 W3H64M16E-XB2X 400–667 1.8 79 PBGA 11 mm x 14 mm C, I, M 256 MB 2 x 64M x 16 W3H264M16E-XSBX 400–667 1.8 79 PBGA 11 mm x 14 mm C, I, M 256 MB 2 x 64M x 16 W3H264M16E-XB2X 400–667 1.8 79 PBGA 11 mm x 14 mm C, I, M 256 MB 32M x 64 W3H32M64E-XBX 400–667 1.8 208 PBGA 16 mm x 20 mm C, I, M 256 MB 32M x 72 W3H32M72E-XBX 400–667 1.8 208 PBGA 16 mm x 20 mm C, I, M 512 MB 64M x 64 W3H64M64E-XBX 400–667 1.8 208 PBGA 16 mm x 22 mm C, I, M 512 MB 64M x 72 W3H64M72E-XBX 400–667 1.8 208 PBGA 16 mm x 22 mm C, I, M 1 GB 128M x 72 W3H128M72E-XSBX 400–667 1.8 208 PBGA 16 mm x 22 mm C, I, M 1 GB 128M x 72 W3H128M72E-XNBX 400–667 1.8 208 PBGA 16 mm x 22 mm C, I, M DDR PERFORMANCE, LAYOUT AND DESIGN BENEFITS ▪ Reduce board real estate, I/O requirements and memory down routing by up to 70%, permitting additional product options and board design opportunities. ▪ Save 2–4 PWB layers and cut design time up to four weeks by reducing memory down routing. ▪ Improve parasitic performance (L, pu, C) at first and second levels with reduced bus capacitance and better signal integrity on the PCB. ▪ Obtain wider pitch on BGA leads with reduced I/O and routing for easier class-3 PWB rule compliance. ▪ Minimize maintenance costs with consistent MCP interface, despite part obsolescence issues. * Advanced product — This product is developmental, is not qualified and is subject to change or cancellation without notice.

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