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Reference Guide: Microelectronics Memories with Extended Temperatures

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QUICK REFERENCE GUIDE Microelectronics: Memory mrcy.com 2 The Mercury Systems logo and the following are trademarks or registered trademarks of Mercury Systems, Inc.: Mercury Systems, Innovation That Matters, and BuiltSECURE. Other marks used herein may be trademarks or registered trademarks of their respective holders. Mercury believes this information is accurate as of its publication date and is not responsible for any inadvertent errors. The information contained herein is subject to change without notice. © 2021 Mercury Systems, Inc. 8066.00E-0621-ds-ME_Memory_QuickRefGuide MADE IN USA Learn more Visit: mrcy.com Corporate Headquarters 50 Minuteman Road Andover, MA 01810 USA +1 978.967.1401 tel +1 866.627.6951 tel +1 978.256.3599 fax International Headquarters Mercury International Avenue Eugène-Lance, 38 PO Box 584 CH-1212 Grand-Lancy 1 Geneva, Switzerland +41 22 884 51 00 tel MEMORIES WITH EXTENDED TEMPERATURES (CONTINUED) Registered DDR2 SDRAM MCP Size Organization Part Number Data Rate (Mb/s) Voltage (V) Package Dimensions Temperature 1 GB 128M x 72 W3H128M72ER-XNBX 400–667 1.8 255 PBGA 21 mm x 23 mm C, I, M DDR SDRAM MCP Size Organization Part Number Data Rate (Mb/s) Voltage (V) Package Dimensions Temperature 128 MB 64M x 16 W3E64M16S-XBX 200–333 2.5 60 PBGA 10 mm x 12.5 mm C, I, M 256 MB 32M x 64 W3E32M64S-XB2X 200–333 2.5 219 PBGA 21 mm x 21 mm C, I, M 256 MB 32M x 64 W3E32M64S-XB3X 200–333 2.5 208 PBGA 13 mm x 22 mm C, I, M 256 MB 32M x 64 W3E32M64SA-XB2X 200–333 2.5 219 PBGA 21 mm x 21 mm C, I, M 256 MB 32M x 72 W3E32M72S-XBX 200–333 2.5 219 PBGA 26 mm x 32 mm C, I, M 256 MB 32M x 72 W3E32M72S-XB3X 200–333 2.5 208 PBGA 13 mm x 22 mm C, I, M 256 MB 32M x 72 W3E32M72SR-XBX 200–266 2.5 208 PBGA 13 mm x 22 mm C, I, M 256 MB 512M x 72 W332M72V-XSB2X 100–133 3.3 208 PBGA 16 mm x 22 mm C, I, M 512 MB 64M x 72 W3E64M72S-XBX 200–266 2.5 219 PBGA 25 mm x 32 mm C, I, M SSRAM MCP Size Organization Part Number Speed (MHz) Voltage (V) Package Dimensions Temperature 4 MB 512K x 72 NBL WEDPZ512K72V-XBX 100–150 3.3 152 PBGA 17 mm x 23 mm C, I, M 4 MB 512K x 72 NBL WEDPZ512K72S-XBX 100–150 2.5 152 PBGA 17 mm x 23 mm C, I, M SDRAM MCP Size Organization Part Number Speed (MHz) Voltage (V) Package Dimensions Temperature 256 MB 32M x 72 W332M72V-XB2X 100–133 3.3 219 PBGA 21 mm x 25 mm C,I,M NOR Flash MCP Size Organization Part Number Speed (ns) Voltage (V) Package Dimensions Temperature 32 MB 8M x 32 W 78M32VP-XBX * * 110, 120 3.3 159 PBGA 13 mm x 22 mm C, I, M 64 MB 8M x 64 W 78M64VP-XSBX * * 110, 120 3.3 159 PBGA 13 mm x 22 mm C, I, M 256 MB 64M x 32 W 764M32V1-XBX 100, 120 3.3 107 PBGA 14 mm x 17 mm C, I, M 512 MB 2 x 64M x 32 W 7264M32V1-XSBX 110, 120 3.3 107 PBGA 14 mm x 17 mm C, I, M 1G B 4 x 64M x 32 W 7464M32V1-XSBX 110, 120 3.3 107 PBGA 14 mm x 17 mm C, I, M 1G B 4 x 128M x 16 F V4128M16-XBX 110, 120 3.3 107 PBGA 14 mm x 17 mm C, I, M ** Not recommended for new designs.

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