Product References

www.mrcy.com sixteen discrete DDR4 devices of 1GB capacity each are used to provide a total of 8GB DRAM supporting the application's processing requirements with error correcting code (ECC). The sixteen devices are equally distributed over the available two-dimensional board area. Mercury Systems stacking technology exploits the unused third dimension by vertically stacking and connecting memory in a low- profile, ruggedized package. By replacing sixteen individual 1GB DRAM devices with one Mercury memory device, space savings of 87% are achieved in this example, excluding terminations and decoupling. The system designer is now free to use the newly available 87% board space for placement of other components needed to integrate additional sensor subsystems. Although this example demonstrates the footprint reduction for a DDR4 application, Mercury also offers a wide breadth of high-performance space-saving solutions using other classes of memory. These solutions span from legacy technologies in ceramic packages, such as EEPROM, NOR Flash, and SRAM, through DDR2 and DDR3 to 1.2V DDR4 SDRAM with speeds up to 3200 Mb/s. To meet application-specific requirements, three different grades of memory products are available: Commercial (0°C to +70°C), Industrial (-40°C to +85°C), and Military (-55°C to +125°C) grades. Where critical for performance in the smallest possible footprint, mixed memory and custom memory solutions meeting design-specific requirements are available. Designing Security and Trust Into Memory Semiconductor memory is an important commodity used in the construction of our memory devices. The commercial market has no shortage of suppliers capable of producing commercial-, industrial-, and automotive-grade memory solutions in chip package form. However, the majority of these suppliers manufacture their products outside of the United States. Of particular concern, some are in close proximity to highly unpredictable foreign governments. Although this is of no consequence during extended times of peace, supply chain continuity is far from assured in the event of a military conflict in or around these tumultuous regions. To provide the highest degree of supply chain continuity, Mercury only sources semiconductor memory from trusted domestic corporations. The same scrutiny is applied to vendors of other materials and components used in the construction of our products. Through judicious selection of supply chain vendors, Mercury builds security and trust into High Density Secure Memory products from the moment components and materials are selected and incorporated into our designs. Security of commodity components, however, is insufficient to produce a truly secure and trusted product for a defense application. As an additional layer of security, our memory devices are designed and manufactured in a Defense Microelectronics Activity (DMEA) trusted facility. Our facility also maintains AS9100, ISO 9001, JESTD001, and IPC 610 Class 3 certifications. Mercury's commitment to industrial security excellence is evidenced by our 2016 James S. Cogswell Outstanding Security Achievement Award from the Defense Security Service. Mercury's memory solutions have been successfully integrated by defense prime contractor partners into many state-of-the-art military programs for more than 30 years. As such, classified data at Mercury's facilities is protected using protocols established by the Department of Defense (DoD) in full isolation from corporate network and systems. Furthermore, Mercury recognizes that its electronic records may be of interest to foreign entities. As such, we maintain and regularly update a vigilant internal cyber security program modeled after the Center for Internet Security (CIS) Critical Security Controls. Mercury is also an active member of the Defense Security Information Exchange (DSIE) and the Advanced Cyber Security Center (ACSC). All companies take security of physical assets seriously. Mercury goes farther, embedding security and trust into product design, supply chain management, manufacturing, and electronic asset protection. Additional Benefits of Mercury High Density Secure Memory Recognizing the challenges faced by system designers today, High Density Secure Memories devices are designed to fit into the tightest of spaces without compromising security or performance standards. Our miniaturization technology offers a variety of other benefits, including: • 100% burn-in and electrical test for the highest quality assurance • Military grade product available for the harshest of environmental conditions; Commercial and industrial grade product for less harsh operating environments but facing similar physical space constraints • Eutectic solder balls, eliminating the possibility of strain-related failures associated with lead-free solder used on commercial memory devices • Increased solder ball pitch, up to 1.0mm, to enhance second level board reliability compared to commercial devices with reduced pitch no greater than 0.8mm • Up to 88% component count reduction, simplifying the supply chain while enabling higher manufacturing floor throughput • Multiple data widths available, including x8, x16, x32, x64, and x72 • Includes address/control terminations and decoupling inside packages of DDR3 and DDR4 devices • Available component End of Life management to provide long-term supply continuity

• Cover