Product References

Product Brief: Military Grade High-Density Memory

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PRODUCT BRIEF Military-Grade High-Density Memory Compact and rugged DDR memory components for SWaP-constrained applications Rugged, high-density memory is a critical element in advanced edge processing. As these systems get smaller and their processing needs increase, memory modules must deliver high-performance in a small form factor. SWaP-optimized, compact BGA packages consisting of multiple stacked die save board space and improve reliability. Our environmentally tested BGA packaged solutions are manufactured through a trusted supply chain in a DMEA- and AS9100-certified facility. Our relationships with semiconductor suppliers and the ability to redesign and provide form-fit-function (FFF) replacement help mitigate obsolescence risks. Highlights ▪ Advanced miniaturization technology resulting in up to 87% space savings ▪ Compact plastic BGA package consisting of multiple stacked die ▪ Military-grade performance with DMEA-trusted manufacturing and supply chain ▪ Military, industrial and commercial temperature ranges Featured Product DDR4 DDR SDRAM delivers trusted, reliable performance in a compact, ruggedized package

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