Issue link: https://read.uberflip.com/i/1516423
7 Make innovative design decisions faster Design and engineering teams can increase their agility and innovate more freely with cloud-based simulation, remote access, and high performance computing (HPC). Their designs get into production faster, accelerating time to market. Designing and testing products in the virtual world is faster and less expensive than making physical prototypes. When running on cloud infrastructure, the right level of HPC allows product developers and engineers to solve complex problems using 2D and 3D model- based design and large-scale, parallel simulations. The result is the reduction or elimination of time-consuming prototype production. Product teams can explore manufacturing-ready outcomes early in the production process to optimize for cost, material, and the best manufacturing techniques. By quickly running large-scale simulations and parameter sweeps, HPC enables faster advanced simulation, reducing time to results and time to market. For generative design, which enables engineers to create thousands of design options by simply defining their design problems, HPC can run hundreds of simulations in hours instead of days. In addition, AWS IoT TwinMaker makes it faster and easier to create digital twins to better understand new designs before prototyping. Global Unichip Corporation (GUC) helps system and semiconductor companies develop application-specific integrated circuits (ASICs), or microchips. Each generation of ASICs has a more complex design and uses more advanced semiconductor processes, making it harder to reach quality targets. What's more, these ASICs become components in data center systems, where uptime and system reliability are critical. To meet these challenges, GUC engaged AWS Select Technology Partner proteanTecs, which uses deep data and machine learning to predict failures in electronics. ProteanTecs uses AWS to achieve the scalability and flexibility it needs to support high-performance computing workloads running millions of simulations each day. The AWS-powered proteanTecs analytics platform combines data derived from Universal Chip Telemetry technology embedded in the ASICs with predictive artificial intelligence and data analytics to track and repair silicon defects before they cause system failure. Thanks to proteanTecs and AWS, GUC has increased chip quality and reliability and extended visibility and repairability into the field. Read the case study › GUC increases ASIC reliability and quality at scale with AWS USE CASE