WHITE PAPER
Advancing Signal and Data Processing for Space Payloads
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© 2024 Mercury Systems, Inc. 8216.00E-1024-wp-Space_Payloads
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SUMMARY
The ability to effectively manage and process vast quantities
of data from space payloads is crucial as government and
industr y operations increasingly rely on satellite data for
decision-making and tactical advantages. The evolution
of microelectronics in the space data chain is driven by
advancements in system packaging and the availability
of high-per forming COTS hardware. This has shor tened
the development-to-deployment timeframe and has
lowered costs as compared to traditional systems, which
is par ticularly beneficial for developers and manufacturers
of LEO systems because they have a shor ter operational
lifespan and their networks may require numerous satellites.
It is also driving the transition to technology that is smaller,
faster, and more power ful—from data recorders,
RF microwave amplifiers, frequency conver ters to power
supply cards, direct RF conver ters, flash memor y, custom
multichip modules, processing cards, and more.
The integration of robust signal processing technologies
and the replacement of traditional space technology with
new microelectronic solutions is essential to mitigate risks
posed by environmental complexities and ensure reliable
per formance in harsh conditions. Emphasizing these
innovations, along with deep space exploration tools and
miniaturized storage solutions, will greatly benefit assets
such as LEO satellites, radiation-hardened weapons, aircraft,
ground-based command and control, launch vehicles, and
space exploration missions.
FLIGHT HERITAGE HAS BEEN IN OUR ORBIT FOR 40 YEARS
The Mercury Processing Platform has supported the missions of more than
75 different spacecraft, in all orbits, including every Mars flight over the past
20 years. Parts are carefully selected by engineering and supply chain experts
for space survivability and components undergo full element evaluation and
environmental screening to MIL-PRF/DTL, ESA, NASA, or other standards.
In 2022, Mercury opened a new 150,000-square-foot, DMEA-accredited facility in
Phoenix, Arizona, dedicated to state-of-the-art custom microelectronics packaging.
Our facilities and history of innovation—combined with key partnerships with
commercial leaders such as Intel, AMD, Micron, and NVIDIA—allow Mercury to offer
space-level solutions based on commercially developed technology with shorter
deployment times and reduced costs.
