PRODUCT BRIEF
mrcy.com
Military-Grade
High-Density Memory
Compact and rugged DDR memory components for SWaP-constrained applications
Rugged, high-density memory is a critical element in advanced
edge processing. As these systems get smaller and their processing
needs increase, memory modules must deliver high-performance in a
small form factor. SWaP-optimized, compact BGA packages consisting
of multiple stacked die save board space and improve reliability.
Our environmentally tested BGA packaged solutions are manufactured through a
trusted supply chain in a DMEA- and AS9100-certified facility. Our relationships with
semiconductor suppliers and the ability to redesign and provide form-fit-function (FFF)
replacement help mitigate obsolescence risks.
Highlights
▪ Advanced miniaturization technology resulting in up to 87% space savings
▪ Compact plastic BGA package consisting of multiple stacked die
▪ Military-grade performance with DMEA-trusted manufacturing and supply chain
▪ Military, industrial and commercial temperature ranges
Featured Product DDR4
DDR SDRAM delivers trusted, reliable
performance in a compact, ruggedized
package